Electronic assembly fabrication: chips, circuit boards, packages, and components.-- ed.1
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Format: | Book |
Language: | English |
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New York
McGraw-Hill
2002
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245 | |a Electronic assembly fabrication: chips, circuit boards, packages, and components.-- ed.1 | ||
260 | |a New York |b McGraw-Hill |c 2002 | ||
300 | |a xv, 671 p.; bib.; ill.; ind.; 24 cm | ||
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